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| 两侧同时换到之前的修订记录 前一修订版 后一修订版 | 前一修订版 | ||
| public:it:semeconductor [2023/02/23 14:56] – [半导体行业组成：] oakfire | public:it:semeconductor [2023/02/23 16:33] (当前版本) – [半导体行业组成：] oakfire | ||
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| ==== 半导体行业组成： ==== | ==== 半导体行业组成： ==== | ||
| * Chip Intellectual Property (IP) Cores | * Chip Intellectual Property (IP) Cores | ||
| - | * {{: | + | * {{ : |
| * Electronic Design Automation (EDA) Tools | * Electronic Design Automation (EDA) Tools | ||
| * 该行业由三个美国供应商主导--Cadence、Mentor（现在是西门子的一部分）和Synopsys | * 该行业由三个美国供应商主导--Cadence、Mentor（现在是西门子的一部分）和Synopsys | ||
| 行 11: | 行 11: | ||
| * 随着芯片变得越来越复杂，开始插入人工智能辅助工具来自动化加快芯片设计流程。 | * 随着芯片变得越来越复杂，开始插入人工智能辅助工具来自动化加快芯片设计流程。 | ||
| * Specialized Materials | * Specialized Materials | ||
| - | * Silicon wafers – and to make those they need crystal growing furnaces | + | * Silicon wafers(硅晶晶圆) |
| * Over 100 Gases are used – bulk gases (oxygen, nitrogen, carbon dioxide, hydrogen, argon, helium), and other exotic/ | * Over 100 Gases are used – bulk gases (oxygen, nitrogen, carbon dioxide, hydrogen, argon, helium), and other exotic/ | ||
| - | * Fluids (photoresists, | + | * Fluids ([[wp>photoresists]]光刻胶, top coats涂料, [[https:// |
| - | * Photomasks | + | * [[wp>Photomasks]] |
| * Wafer handling equipment, dicing | * Wafer handling equipment, dicing | ||
| - | * RF Generators | + | * [[https:// |
| * Wafer Fab Equipment (WFE) | * Wafer Fab Equipment (WFE) | ||
| + | * 五家公司主导行业：Applied Materials, KLA, LAM, Tokyo Electron and ASML | ||
| + | * 是地球上最复杂（也是最昂贵）的机器 | ||
| * “Fabless” Chip Companies | * “Fabless” Chip Companies | ||
| * Integrated Device Manufacturers (IDMs) | * Integrated Device Manufacturers (IDMs) | ||
| + | * 新的前沿芯片 (3nm) 流片的平均成本现在为 5 亿美元 | ||
| * Chip Foundries | * Chip Foundries | ||
| + | * They design unique processes using this equipment to make the chips,But they don’t design chips | ||
| + | * [[https:// | ||
| + | * Fabs are short for fabrication plants – the factory that makes chips | ||
| + | * Chips are probably the most complicated products ever manufactured. | ||
| * Outsourced Semiconductor Assembly and Test (OSAT) | * Outsourced Semiconductor Assembly and Test (OSAT) | ||
| + | ==== Fabs issue ==== | ||
| + | * 建造晶圆厂的成本飙升——现在一个芯片工厂的成本超过 100 亿美元。原因之一是制造芯片所需的设备成本飙升 | ||
| + | * 荷兰ASML公司的一台先进光刻机就耗资1.5亿美元 | ||
| + | * There are ~500+ machines in a fab (not all as expensive as ASML) | ||
| + | * 晶圆厂建筑非常复杂。制造芯片的洁净室只是一组复杂管道的冰山一角，这些管道在正确的时间和温度下将气体、电力、液体全部输送到晶圆厂设备中 | ||
| + | * 保持领先的成本高达数十亿美元，这意味着大多数公司已经退出了。2001年，有17家公司在生产最先进的芯片，今天只有两家：三星和台积电。{{ : | ||
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